U.S. ATLAS E.T.C.
	WBS Profile Estimates
	Funding Source:	All	Funding Type:	Project	2/27/01 9:55:00 AM
	Institutions:	U. of New Mexico
	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
1.1.1	Pixels	0	0	0	0	0	125	35	0	0	0	160
	1.1.1.1	Mechanics and Final Assembly	0	0	0	0	0	44	0	0	0	0	44
	1.1.1.1.1	Design	0	0	0	0	0	44	0	0	0	0	44
	1.1.1.1.1.1	Prototype Design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.1.1	Design - LBNL	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.1.2	Design - HYTEC, Inc.	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2	Production Design	0	0	0	0	0	44	0	0	0	0	44
	1.1.1.1.1.2.1	Sectors	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2.2	Disk Support Rings and 	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2.3	Support Frame	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2.4	Support Tube	0	0	0	0	0	0	0	0	0	0	0
	Page 1 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.1.1.2.5	Services	0	0	0	0	0	44	0	0	0	0	44
	1.1.1.1.1.2.5.1	Services Design - New 	0	0	0	0	0	44	0	0	0	0	44
	1.1.1.1.1.2.5.2	Services Design - LBNL	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2.6	Disk Assembly	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2.7	Final Assembly	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2.8	Test Equipment	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2.9	Integration/Project 	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.1.2.10	Installation	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2	Development and Prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.1	Disk Sectors	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.2	Disk Support Rings	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.3	Support Frame	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.4	Support Tube	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.5	Services	0	0	0	0	0	0	0	0	0	0	0
	Page 2 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.1.2.5.1	Cables and Connections	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.5.2	Coolant Connections	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.6	Disk Assembly	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.7	Final Assembly and 	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.2.8	Test Equipment	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3	Production	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.1	Disk Sectors	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.2	Disk Support Rings	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.3	Support Frame	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.4	B-layer Support	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.5	Support Tube	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.6	Endplug Thermal Barrier	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.7	Services	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.7.1	Mechanical support	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.7.2	Cables and Connections	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.7.3	Coolant pipes and 	0	0	0	0	0	0	0	0	0	0	0
	Page 3 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.1.3.7.4	Patch Panel 0	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.8	Disk Assembly	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.9	Disk Region Final 	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.10	Test Equipment	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.1.3.11	 Installation	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.2	Sensors	0	0	0	0	0	81	35	0	0	0	116
	1.1.1.2.1	Design/Engineering	0	0	0	0	0	35	35	0	0	0	70
	1.1.1.2.1.1	Test design	0	0	0	0	0	35	35	0	0	0	70
	1.1.1.2.1.1.1	 Design - New Mexico	0	0	0	0	0	35	35	0	0	0	70
	1.1.1.2.3	Production	0	0	0	0	0	46	0	0	0	0	46
	1.1.1.2.3.1	Barrels, Disks and B-layer(s	0	0	0	0	0	46	0	0	0	0	46
	1.1.1.2.3.1.1	Preproduction	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.2.3.1.1.1	Preproduction costs - 	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.2.3.1.1.2	Preproduction - Ohio State	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.2.3.1.1.3	Preproduction - Oklahoma	0	0	0	0	0	0	0	0	0	0	0
	Page 4 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.2.3.1.2	Production	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.2.3.1.3	Testing	0	0	0	0	0	46	0	0	0	0	46
	1.1.1.3	Electronics	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1	Design/Engineering	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.1	IC design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.1.1	Design - LBNL	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.1.1.1	Senior Engineering	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.1.1.2	Junior Engineering	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.1.2	Design-OSU	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.2	Test design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.2.1	LBL Engineering	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.2.2	OSU Engineering	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.1.3	Systems Engineering	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2	Development and Prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.1	Atmel/DMILL prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.1.1	FE-D2	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.1.2	FE-D3	0	0	0	0	0	0	0	0	0	0	0
	Page 5 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.3.2.2	Honeywell	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.3	0.25 Micron	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.3.1	TSMC prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.3.2	1st prototype	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.3.3	2nd prototype	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.4	Test 	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.2.4.1	Equipment/Test Boards	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3	Production	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.1	Front-end ICs	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.1.1	Outer system	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.1.1.1	Atmel(DMILL)	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.1.1.2	IBM	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.1.2	B-layer	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.1.3	FE Testing	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.2	Optoelectronics	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.2.1	Production	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.3.3.2.2	Testing, Dicing and Sorting	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4	Flex Hybrids/Optical Hybrids	0	0	0	0	0	0	0	0	0	0	0
	Page 6 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.4.1	Design/Engineering	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.1.1	Prototype design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.1.1.1	Flex hybrid	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.1.1.2	Pigtail	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.1.1.3	Optical Hybrids	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.1.2	Production design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.1.2.1	Flex Hybrid	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.1.2.2	Pigtail	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.1.2.3	Optical components	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.2	Development and Prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.2.1	Flex hybrids	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.2.2	Optical prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.2.3	Pigtails prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3	Production	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.1	Flex hybrid	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.1.1	Bare Flex Hybrids	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.1.2	Components and Assembly	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.1.3	Testing	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.1.3.1	Albany	0	0	0	0	0	0	0	0	0	0	0
	Page 7 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.4.3.1.3.2	Oklahoma	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.2	Pigtails	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.3	Optical hybrids	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.3.1	Optical packages and 	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.3.2	Optical hybrids	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.4.3.3.3	Testing	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5	Module Assembly/Test	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.1	Design/Engineering	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.1.1	Prototype Design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.1.2	Production Design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.1.3	Testing Design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.1.3.1	Mechanical Prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.1.3.2	Functional Prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2	Development and Prototypes	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.1	X-ray Inspection	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.2	Wafer Thinning	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.3	Wafer Dicing and Die Sort	0	0	0	0	0	0	0	0	0	0	0
	Page 8 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.5.2.4	Dummy wafers	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.5	Module Assembly and 	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.5.1	Tooling	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.5.2	Assembly	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.5.3	Testing	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.5.4	Equipment	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.6	Module Attachment	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.6.1	Tooling	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.6.2	Assembly	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.2.6.3	Testing	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3	Production	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.1	IC Wafer Thinning	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.2	Dicing of IC Wafers	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.3	IC Die Sort	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.4	Module Assembly	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.4.1	Tooling	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.4.2	Assembly - LBNL	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.4.3	Assembly - Ohio State	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.5	Module Testing	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.5.1	Bare Module Testing	0	0	0	0	0	0	0	0	0	0	0
	Page 9 of 10

	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	1.1.1.5.3.5.2	Assembled Module Testing	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.6	Module Attachment	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.7	Sector Electrical Testing	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.3.8	Production database	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.6	Beam/System Test Support	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.6.1	Test Beam Support	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.6.2	System test support	0	0	0	0	0	0	0	0	0	0	0
	Page 10 of 10