U.S. ATLAS E.T.C.
	WBS Profile Estimates
	Funding Source:	All	Funding Type:	Project	10/24/00 2:31:52 PM
	Institutions:	All
	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
1.1.1.5	Module Assembly/Test	0	0	0	0	0	194	282	420	206	0	1102
	1.1.1.5.1	Design/Engineering	0	0	0	0	0	82	96	14	0	0	191
	1.1.1.5.1.1	Prototype Design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.1.2	Production Design	0	0	0	0	0	0	0	0	0	0	0
	1.1.1.5.1.3	Testing Design	0	0	0	0	0	82	96	14	0	0	191
	1.1.1.5.2	Development and Prototypes	0	0	0	0	0	112	122	46	0	0	280
	1.1.1.5.2.1	X-ray Inspection	0	0	0	0	0	6	6	6	0	0	17
	1.1.1.5.2.2	Wafer Thinning	0	0	0	0	0	0	0	0	0	0	1
	1.1.1.5.2.3	Wafer Dicing and Die Sort	0	0	0	0	0	1	3	2	0	0	6
	1.1.1.5.2.4	Module Assembly and 	0	0	0	0	0	84	83	30	0	0	196
	1.1.1.5.2.5	Module Attachment	0	0	0	0	0	22	30	8	0	0	60
	1.1.1.5.3	Production	0	0	0	0	0	0	65	360	206	0	631
	1.1.1.5.3.1	IC Wafer Thinning	0	0	0	0	0	0	0	2	2	0	3
	1.1.1.5.3.2	Dicing of IC Wafers	0	0	0	0	0	0	0	12	12	0	25
	1.1.1.5.3.3	IC Die Sort	0	0	0	0	0	0	3	51	4	0	58
	1.1.1.5.3.4	Module Assembly	0	0	0	0	0	0	17	108	48	0	173
	1.1.1.5.3.5	Module Testing	0	0	0	0	0	0	45	138	63	0	245
	1.1.1.5.3.6	Module Attachment	0	0	0	0	0	0	0	12	39	0	51
	1.1.1.5.3.7	Sector Electrical Testing	0	0	0	0	0	0	0	25	35	0	60
	1.1.1.5.3.8	Production database	0	0	0	0	0	0	0	12	3	0	16
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	WBS	FY 96 	FY 97 	FY 98 	FY 99 	FY 00 	FY 01 	FY 02 	FY 03 	FY 04 	FY 05 	Total 
	Number	Description	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)	(k$)
	Page 2 of 2